Signal Integrity / Power Integrity Engineer – Packaging

Marvell Technology Group

Location: Burlington, Vermont

Type: Full Time

Education: Bachelor's Degree

Experience: 5 - 10 Years

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.


At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.


Your Team, Your Impact


The Marvell Advanced Packaging team is responsible for supporting customers with package designs that meet challenging electrical requirements. Many of the new designs are requiring multi-chip and multiple component configurations with high speed IP requirements.


What You Can Expect

As an Advanced Packaging SI/PI Engineer, you will be responsible of the following:

  • Evaluating designs for challenging electrical requirements
  • Close interaction with layout engineers and IP teams will be required to optimize the electrical performance.
  • Other simulation related tasks, such as new EDA tool evaluations, flow development & scripting for efficiency.


Requirements include:

  • Knowledge of signal integrity and power integrity
  • Experience with power plane design, modeling and analysis using tools like PowerSI, SIwave
  • An understanding of circuit elements and simulation techniques
  • Experience with at least one of the following programming languages –tcl, Java, Python, Perl, Skill, C++
  • Ability to work with engineers in multiple locations and geographies
  • Strong communication, presentation and documentation skills


The ideal candidate would have:

  • Experience with 2.5D/3D package development
  • Experience with VNA and TDR measurements for packages and PCBs characterization
  • Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
  • Understanding, debugging and simulations of EMI/EMC problems


What We’re Looking For


Bachelor’s degree in Electrical Engineering or related fields and 5-10 years of related professional experience.
Master’s degree and/or PhD in Electrical Engineering or related fields with 3-5 years of experience.

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