Package Design Engineer – Power Integrity Lead

Marvell Technology Group

Location: Burlington, Vermont

Type: Full Time

Education: Bachelor's Degree

Experience: Greater than 10 years

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

 

Your Team, Your Impact

 

The Marvell Advanced Packaging team is responsible for supporting customers with package designs that meet challenging electrical requirements. High speed signaling and challenging power delivery networks require complex and custom solutions to meet constantly advancing application needs. Many of the new designs require multi-chip and multiple component configurations with high-speed IP requirements. In addition, our team is advancing Marvell’s expertise in 3D packaging, Co-packaged optics and cutting-edge substrate materials. We work with the world’s leading manufacturers to solve our client’s most challenging designs and integrations with industry-leading packaging techniques.

 

What You Can Expect

As a Power Integrity leader in the Advanced Packaging design team, you will be responsible for the following:

  • Power Delivery Network (PDN) design and optimization within 2D/2.5D/3D packages
  • Power Integrity Analysis and simulation of package designs and advanced studies
  • Providing thought leadership on advanced packaging techniques and advancing Marvell’s capabilities and understanding of industry trends
  • Interfacing with product design teams for optimized floor-planning, package related design oversight and power delivery network design
  • Design flow optimization and development for cycle-time reduction and quality assurance

 

This job requires working a hybrid schedule, on-site for a minimum of two (2) days per week with one of Marvell’s packaging design teams in either Santa Clara, CA, Westlake Village, CA, Boise, ID, Ottawa, Ontario or Burlington, VT.

 

What We’re Looking For

 

The ideal candidate will have expert level knowledge as a Power Integrity engineer as well as in-depth knowledge of Signal Integrity concepts and design strategies.

In addition, the candidate will possess a bachelor’s degree in Electrical Engineering or related fields and 15+ years of related professional experience or master’s degree and/or PhD in Electrical Engineering or related fields with 12+ years of experience.

 

Marvell is looking for an individual contributor with demonstrated success in the following areas:

  • Evaluating designs for challenging electrical requirements
  • Close interaction with packaging layout engineers and IP teams to optimize electrical performance
  • Simulation tasks, as well as new EDA tool evaluations, design flow development and scripting for efficiency and automation.

 

Skills needed to be successful in this role:

  • Advanced knowledge of signal integrity and power integrity
  • Experience with power plane design, modeling and analysis using tools like PowerSI, SIwave
  • Expertise in system-level power integrity modeling, extractions, and circuit simulations
  • Experience with at least one of the following programming languages: TCL, Java, Python, Perl, Skill, C++
  • Ability to work with engineers in multiple locations and geographies
  • Strong communication, presentation and documentation skills

 

The ideal candidate would have: 

  • Experience with 2.5D/3D package development, including interposer design
  • Experience in power integrity methodology and workflow development for cross-functional teams
  • Experience with VNA and TDR measurements for packages and PCBs characterization
  • Experience with ADS and HSPICE circuit simulation
  • Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
  • Understanding, debugging and simulations of EMI/EMC problems
  • Working knowledge of Voltus die model generation

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