Marvell is seeking a talented package development leader to contribute to the strategic development of advanced packages for next generation data center applications.

What You Can Expect

This engineer will be responsible for leading small project teams of design and simulation engineers to deliver innovative high quality packaging solutions.  The engineer will also interface with package suppliers to select package technology to ensure manufacturability, and compliance with performance, reliability, and cost requirements.

*This is a hybrid role requiring a minimum of 2 days per week on site in Burlington, VT.

What We’re Looking For

Requirements

Bachelor’s degree in Computer Science, Electrical Engineering or related fields and a minimum of 5 years of related professional experience.

Job Requirements

• Must have a proven ability to lead development projects involving various cross functional teams like assembly development, physical layout teams, and other related disciples
• Must have familiarity with packaging technologies, materials, package substrate design rules and assembly rules
• Ideal candidate would have familiarity with Cadence design tools
• Ideal candidate would have experience with high-speed electronic packaging for digital and analog ICs
• 2.5D & 3D package development experience is highly desired
• Understanding, debugging and simulations of EMI/EMC problems is also highly desired
• Knowledge of the thermal and mechanical analysis of the IC package development is a plus