ASICs Solutions Architect – MGS

Marvell Technology Group

Location: Burlington, Vermont

Type: Full Time

Education: Bachelor's Degree

Experience: Greater than 10 years

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

MGS has more than 20 years of expertise delivering custom A&D solutions across multiple technology nodes. MGS offers a wide range of solutions and services, including register transfer language (RTL) physical design, wafer and module test, advanced packaging (including MCMs and 2.5D / 3D), IP development, and full turnkey services.

The leading-edge technology portfolio supports Zero Trust requirements by delivering ‘root of trust’ through novel IP supplemented with secure oversight across multiple technologies and emerging semiconductor processes.

What You Can Expect

  • Solution Design: Develop, size ASIC and system solution architectures for customer RFPs
  • Proposal Creation: Create, prize, write detailed customer proposals, including interaction with prizing/sizing teams, management, legal, and other stakeholders
  • Customer relationships: Create deep technical and business relationships with customers
  • Technical Guidance: Provide technical leadership throughout the delivery life cycle, ensuring adherence to best practices and maintaining the core application architecture.
  • Collaboration: Work closely with stakeholders, including business leaders, project managers, and development teams, to understand requirements and translate them into effective solutions.
  • Security Considerations: Address security concerns by incorporating secure design principles, including ‘root of trust’ and multiple layers of hardware security.
  • Custom ASICs: Leverage MGS’s expertise in custom application-specific integrated circuits (ASICs) to create optimized chip solutions.
  • Standard Products: Familiarize yourself with MGS’s portfolio of standard data infrastructure products, including Ethernet switches, optical PAM4, data processing units (DPUs), and more.
  • Direct engagement with customer, internal technical delivery team (IP, design center, technical services, subcontractors), management, legal, pricing, quality/reliability, procurement,  manufacturing, and supply chain
  • Bid & proposal development, including project planning (deliverables, staffing & schedule), cost estimation, and pricing,
  • Develop Contract (Statement of Work) development and contract negotiation – Die planning, intellectual property selection, ASIC engineering services planning. Die size, package size, and power estimations.

What We’re Looking For

·       Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 10-15 years of related professional experience OR Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5-10 years of experience.

·       Must have a broad background in ASIC or other Microelectronics development, with experience in chip architectures

·       Must have expertise in Chip / package interaction

·       Must be able to handle a wide variety of projects and technical challenges including translation of customer requirements into product proposals

·       Ability to size, write and create customer proposals for ASIC solutions.

·       Experience in P development a plus.

·       Must be detail oriented and have excellent communication skills.

·       Experienced in the A&D industry preferred.

·       3D / 2.5D, unique customer solutions, leading edge solutions

·       Ability to independently drive programs

·       Provide technical oversight in sizing and execution

·       Define solutions with customers, work directly with technical experts at customers Uniquely need experts in chip package interaction to support leading edge package types / 3D, leading edge solutions, Support for: Thermal, reliability.

·       Should have customer experience, project management experience, Technical leadership to work with customers, Define requirements

·       Must be Self driving, contribute on technical oversight & roadmap for A&D business.

·       Preferred experience: Leading edge technologies, crypto, NIST standards, chiplet standards, processor selection and tradeoffs, bench marking, PPA tradeoffs, 3rd Party IP, ADCs/DACs, mixed signal integration, industry EDA tools, government contracting,

·       Eligibility for US Security Clearance

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