Marvell’s Central Engineering team is seeking a talented package development leader to contribute to the strategic development of custom advanced 2.5 & 3D packages.

What You Can Expect

This engineer will be responsible for evaluating the mechanical robustness of various architectural design concepts for next generation 3D and 2.5D advanced packages.

What We’re Looking For

Must have:

• Bachelor’s degree in Mechanical Engineering or related fields and 15+ years of related professional experience.
• Experience leading package development projects from concept through development and qualification
• A strong fundamental understanding of the flip chip packaging process and failure modes.
• Stong problem solving skills
• Strong communication, presentation, and documentation skills

Ideal candidates would also have:

• Experience with 2.5D/3D package development
• A strong understanding of substrate design rules ​